Lead - Embedded Hardware

Role

Embedded Hardware Lead – Satellite Payload Electronics

Industry

Space Technology

Location

Ahmedabad, Gujarat, India

Role Type

Full-time

About the Role

Key Responsibilities

• Lead the architecture, design, development, integration, and validation of embedded hardware for satellite payload and high reliability applications.
• Manage, mentor, and technically guide a team of Embedded Hardware Engineers and PCB Layout Designers.
• Own hardware development activities from system requirements and architecture through schematic design, PCB development, bring up, qualification, and production release.
• Design and review hardware platforms based on microcontrollers, microprocessors, FPGAs, high-speed ADCs/DACs, memory devices, RF circuits, and power management components.
• Define and approve PCB stack ups, placement and routing constraints, controlled-impedance requirements, length matching, return paths, grounding, shielding, and analog/digital/RF isolation.
• Conduct schematic and PCB layout reviews for complex multilayer mixed-signal boards.
• Guide signal integrity, power integrity, thermal, EMI/EMC, timing, channel-loss, crosstalk, eye diagram, and power distribution network analyses.
• Lead component selection considering availability, lifecycle, derating, radiation tolerance, environmental capability, and long-term reliability.
• Establish component reliability and qualification requirements, including screening, derating, worst-case circuit analysis, FMEA, and failure investigations.
• Support hardware qualification and environmental testing, including vibration, thermal-vacuum, thermal cycling, EMI/EMC, and functional performance testing.
• Lead board bringup, debugging, root cause analysis, design optimization, and corrective action activities.
• Collaborate with cross-functional teams to resolve system-level electrical, mechanical, thermal, firmware, FPGA, and manufacturing issues.
• Prepare and review design specifications, interface control documents, design analysis reports, test plans, qualification procedures, and technical review documentation.
• Support project planning, task allocation, technical risk management, design reviews, and hardware development schedules.

Minimum Requirements

• Bachelor’s or Master’s degree in Electronics, Electrical Engineering, Embedded Systems, or a related discipline.
• 5+ years of professional experience in embedded hardware, high speed digital, or complex electronic-board design.
• Demonstrated experience leading or managing a hardware team of approximately 3–4 engineers and layout designers.
• Strong experience with microcontroller, microprocessor, and FPGA based hardware platforms.
• Proven experience designing and reviewing complex multilayer mixed signal PCBs.
• Strong knowledge of high speed interfaces, signal integrity, power integrity, clocking, power sequencing, and EMI/EMC design.
• Experience defining and reviewing PCB layout constraints for high-speed digital, analog, RF, memory, clock, and power circuits.
• Hands on experience with hardware bring up, debugging, laboratory testing, and root cause analysis.
• Experience working with cross functional engineering teams throughout the complete hardware development lifecycle.
• Understanding of component derating, reliability analysis, thermal design, qualification testing, and manufacturing considerations.

Preferred Qualifications

• Experience developing electronics for satellites, spacecraft payloads, aerospace, defence, or other high reliability applications.
• Knowledge of space grade, radiation tolerant, and high-reliability electronic components.
• Experience with vibration, thermal-vacuum, thermal cycling, EMI/EMC, and environmental qualification testing.
• Familiarity with radiation effects, component screening, FMEA, worst-case circuit analysis, and applicable space or military standards.
• Experience with RF integration, high-speed data converters, JESD204B/C, PCIe, high-speed SERDES, and SI/PI simulation tools.